甲基磺酸盐电镀锡铅合金

Tin Lead Plating with Methylsulfonate

测定 了甲基 磺酸 盐电沉 积锡 铅合金 的阴 极极化 曲线， 镀液的 分散 能力、复盖能 力、合 金沉积 速度 及镀层的 焊接性能 ，并对结 果进行讨

Cathode polarization curves of electrodeposition rate of methylsulfonate Sn Pb plating, bath throwing power and covering power, alloy deposition rate and soldering property of deposit are determined, with results discussed.