表面贴装器件引脚氧化的处置和预防

Disposition and Prevention of Surface Mount Device Lead Oxidation

目前,表面贴装技术(SMT)以自身的特点和优势,使电子装联技术产生了革命性的变革,在许多领域逐渐成为电子组装技术的主流。表面贴装器件(SMD)在电子设备中的使用比例正逐年增加。文中介绍了SMD引脚氧化对电子设备焊接质量的影响,从采购、检验、库存环境和电装等几个环节分析了造成SMD引脚(球)吸湿氧化的原因,并提出了烘焙、常温去湿等处置方式,从采购、检验、存储、转运及装联环节对如何预防SMD引脚(球)氧化提出了切实可行的建议。

At present the surface mount technology（SMT）,because of its advantages,has brought great change in the electronic assembly technology and become gradually the mainstream of the electronic assembly technology.The application proportion of the surface mount device（SMD） in the electronic equipment is increasing,too.The effect of SMD lead oxidation on soldering quality of electronic equipment is introduced in this paper.The reasons of SMD lead moisture absorption and oxidation are analyzed from purchase,inspection, storage condition,electronic assembly and so on.The disposition means like baking and moisture removal under normal temperature are put forward.Some feasible advice on how to prevent SMD lead oxidation is given from purchase,inspection,storage,transportation and electronic assembly.