摘要
建立起一台加热低电阻率半导体晶片的行波场谐振器及加热器,实际微波电路测试结果与理论分析相当一致,对能够加热直径达150mm晶片的加热器也进行了研究,另外还给出了温度分布的理论推算及实际温度分布的测量结果,
A traveling-wave resonator and applicators for heating low-resistivity semiconductor ribbons and wafers have been studied.The performanee of the microwave circuit agrees reasonably well with theoretical predictions.An applicator for 150-millimeter diameter wafers is described.Theoretical estimates of temperature distributions and some measured temperature distributions are included.
出处
《微波学报》
CSCD
北大核心
1990年第4期28-35,共8页
Journal of Microwaves
关键词
半导体
晶片
微波
行波
谐振器
process healing, Joule heating, Microwave heating, Semiconductor, Traveling wave resonator
