各向异性导电胶研究进展

Research progress of anisotropic conductive adhesive

随着微电子产业的不断发展,电子产品微型化和集成化趋势日益显著,新型电子封装材料也呈快速发展态势,其中各向异性导电胶(ACA)已成为新一代封装材料的主流。对近年来ACA的研究进展进行了综述,并对其今后的发展方向作了展望。

With the continuous development of microelectronics industry,the miniaturization and integrating trends of electronic products were increasingly obvious.The development trend of new type electronic encapsulation materials was also rapid,and the ACA（anisotropic conductive adhesive） was a mainstream product in new generation encapsulation materials.The recent research progress of ACA was summarized,and the future development direction of ACA was expected.