基于Moldflow软件的手机外壳流道平衡优化设计

Design of Balance Optimization for Shell Runner of the Mobile Phone Based on Moldflow Software

针对手机外壳上下盖异模多型腔的流道不平衡问题,利用Moldflow软件的Runner Balance模块进行了优化。结果表明:优化后手机下盖末端充满时间为0.885 8 s,手机上盖末端的充满时间为0.858 8 s,不平衡率控制在3.1%,流动平衡性较好。流道尺寸由初始设计的应嫡3 mm,优化为平衡时的Φ3.739 mm和Φ1.666 mm。V/P转换点的浇口位置压力为29.85 MPa,接近约束条件中的目标压力30 MPa,上下盖型腔内的压力分布比较均匀。

The runner balance of mobile telephone was optimized in view of the runner imbalance of different mould multi-cavity in the design of plastic injection mold by means of Moldflow software. The results showed that the fill time of the back cover of mobile telephone was 0. 885 8 s and the upper cover of mobile telephone was 0. 858 8 s, the imbalance rate was 3.1%, the flow balance was good. The optimized runner size was ψ3.739 mm andψ1. 666 mm while the runner size wasψ3 mm before optimization. The gate location of V/P transformation point was 29.85 Mpa and was close to the target pressure 30 Mpa, the distribution of pressure in upper and back cavities was even.