化学镀Co-Ni-P合金镀层增厚过程中结构和形貌的改变

Changes of Structure and Morphology of Electroless Co Ni P Alloy Coating in Coating Thickening Process

用电子探针、透射电镜、旋转阳极Ｘ射线衍射仪和原子力显微镜分析观察了化学镀ＣｏＮｉＰ合金镀层的成分、结构和表面形貌。化学镀ＣｏＮｉＰ合金开始以晶态沉积， 表面由“圆锥峰”组成。随施镀时间的延长、镀层厚度的增加， 在原子尺寸、添加剂和镀层成分等影响下， 向微晶和非晶态转化， 镀层表面趋于平整。镀层厚度是按叠层生长方式增加的。

Abstract: The composition, structure and surface morphology of electroless deposited Co Ni P alloy coatings were analyzed and observed by ASM SX electron microprobe, H 800 transmission electron microscope, Dmax/RB rotationary anode X diffractometer and Nanoscope Ⅱa atom force microscope. The results show that electroless deposited Co Ni P alloy coating is crystalline in initial stage and the surface of coating is composed of “taper humps”. As plating time was increased, the structure of coating was transformed into microcrystalline and amorphous structure showing smooth surface in coating thickening process under the influence of atom size, additive and the composition of coating. When the coating was piled in layers, its thickness was increased.