摘要
为了提高BGA焊点检测的准确性,基于三维X射线和Fisher准则的基本原理,提出了一种BGA焊点的检测算法.首先采用Fisher准则对BGA断层图像进行分割,从而获得精确的焊点图像,然后提取了BGA焊点常见缺陷的面积特征、连续度特征、位置特征、圆度特征和空洞特征等,在此基础上,设计了一种基于Fisher准则的BGA焊点检测算法.结果表明,算法能有效地检测出短路、偏移、少锡、空洞和开路等BGA焊点缺陷,有较低的误报率和漏报率,能满足实际生产要求.
In order to improve the precision of BGA(ball grid array) solder joint inspection,a BGA solder joint inspection algorithm is proposed based on 3D X-ray and Fisher criterion.BGA solder image segmentation is implemented according to the Fisher criterion to obtain the accurate image,and the features such as area feature,continual area feature,position feature,circle feature and hole feature of BGA solder joint defects are extracted.Then the BGA solder joint inspection algorithm based on Fisher criterion is presented.Experimental results show that the short circuit,shift,lacking solder,void and broken circuit defect can be inspected by the proposed algorithm.The proposed algorithm has high precision and can meet the requirement of application.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2011年第4期59-62,116,共4页
Transactions of The China Welding Institution
基金
粤港关键领域重点突破招标项目(东莞专项)(2009205200013)
