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Erbium germanosilicide Ohmic contacts on Si_(1-x)Ge_x(x=0-0.3) substrates

Erbium germanosilicide Ohmic contacts on Si_(1-x)Ge_x(x=0-0.3) substrates
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摘要 We have studied erbium germanosilicide (ErSiGe) Ohmic contacts on n-type Si_(1-x)Ge_x substrates with differing Ge concentrations (0≤x≤0.3).Thin layers of Ti (20 nm)/Er (20 nm) were deposited on Si_(1-x)Ge_x substrates and then post-annealed at 600°C for 60 s to form a stable ErSiGe film.The structures of the ErSiGe films and ErSiGe/Si_(1-x)Ge_x interfaces were characterized by Transmission Electron Microscopy measurements (TEM).The TEM images showed that the thicknesses of ErSiGe films and the Si_(1-x)Ge_x substrates were about 60 and 50 nm,respectively.The ErSiGe/Si_(1-x)Ge_x structure had a smooth interface.Moreover,no agglomeration or Ge segregation was observed.The contact resistivity of the ErSiGe/Si_(1-x)Ge_x structures was measured by the specially designed four-terminal Kelvin structures.When the Ge concentration of Si_(1-x)Ge_x substrates increased from 10% to 30%,the specific contact resistivity (c) slightly decreased from 9.0×10 7 ·cm 2 to 7.4×10 7 ·cm 2,indicating that the Ge concentration is not the main effect on the c of the ErSiGe/Si_(1-x)Ge_x Ohmic contacts. We have studied erbium germanosilicide (ErSiGe) Ohmic contacts on n-type Si_(1-x)Ge_x substrates with differing Ge concentrations (0≤x≤0.3).Thin layers of Ti (20 nm)/Er (20 nm) were deposited on Si_(1-x)Ge_x substrates and then post-annealed at 600°C for 60 s to form a stable ErSiGe film.The structures of the ErSiGe films and ErSiGe/Si_(1-x)Ge_x interfaces were characterized by Transmission Electron Microscopy measurements (TEM).The TEM images showed that the thicknesses of ErSiGe films and the Si_(1-x)Ge_x substrates were about 60 and 50 nm,respectively.The ErSiGe/Si_(1-x)Ge_x structure had a smooth interface.Moreover,no agglomeration or Ge segregation was observed.The contact resistivity of the ErSiGe/Si_(1-x)Ge_x structures was measured by the specially designed four-terminal Kelvin structures.When the Ge concentration of Si_(1-x)Ge_x substrates increased from 10% to 30%,the specific contact resistivity (c) slightly decreased from 9.0×10 7 ·cm 2 to 7.4×10 7 ·cm 2,indicating that the Ge concentration is not the main effect on the c of the ErSiGe/Si_(1-x)Ge_x Ohmic contacts.
出处 《Science China(Physics,Mechanics & Astronomy)》 SCIE EI CAS 2011年第6期1116-1118,共3页 中国科学:物理学、力学、天文学(英文版)
关键词 基板 透射电子显微镜 结构测量 欧姆接触 隔离观察 接触电阻 TEM specific contact resistivity erbium germanosilicide Ohmic contact Ge concentration
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参考文献10

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