低压等离子喷涂钨薄膜及纳米粉末

Tungsten Thin Films and Nanometer Powder by Low Pressure Plasma Spray

本文采用了一种新的等离子化学工艺来制备钨薄膜。这种工艺采用超细粉或前驱体作为原料,利用低压下等离子使原料气化,蒸发沉积成纳米尺寸颗粒,形成等轴晶和柱状晶结构,这与传统的等离子喷涂差异很大,传统的等离子喷涂得到的颗粒为典型的扁平化结构。颗粒尺寸分析表明这种技术制备的钨粉末粒度为30～150nm,制备的沉积层中的钨颗粒尺寸较大,这主要是因为晶粒长大引起的。

A new plasma chemical process has been found that produces tungsten thin films. Using fine powders or precursors as feedstocks,the plasma process operated at very low pressures vaporizes the feedstocks and then deposits nanometer size grains. Deposition kinetics of structures produced with this technique vary greatly from classical plasma spray. Equiaxed and columnar grains are formed instead of typical splat structures. Analysis of particles produced with this technique has shown 30～150 nanometer tungsten grains can be produced. However analysis of deposits produced on substrates has shown larger grain sizes are produced. The difference in size is believed to be due to grain growth.