摘要
提出改进的测量电子焊膏润湿方法,实时测量焊球在基板润湿过程变化,分析得到不同焊膏在本实验条件下的活性范围,总结出动态延展实验方法是通过溶剂的溢出和挥发、焊膏和焊料球的收缩、焊料球的稳定、气泡的生存期这几个方面来评价动态润湿过程的。
An improved method for predicting solder interconnect wetting was developed to reveal the cause of poor wetting during pip chip assembly.The contact angle relaxation of spreading over time was measured in specially designed experimental setup for model development.The activity ranges of different solders were developed.An evaluation criterion of dynamic extension experiment can be divided into four sequent stages： solvent effusion and volatilization,solder paste pattern shrinkage,solder paste and solder ball stabilization,tin endurance time.
出处
《热加工工艺》
CSCD
北大核心
2011年第9期152-154,共3页
Hot Working Technology
关键词
动态延展法
焊料
温度曲线
dynamic extension
solder
temperature curve
