国际钎焊技术最新进展

Reviews on latest advances in brazing and soldering technologies

总结了最近3年来的4次国际焊接会议有关钎焊技术的最新进展.介绍了轻合金(包括铝合金、钛合金、镁合金)用新型钎料(或钎剂),锡基、Au-Ge等低温钎料,以及陶瓷钎焊用高温钎料的最新研究成果;新颖的纳米复合钎料和纳米叠层箔带中间层扩散焊技术的研究得到了关注;特殊的钎焊新工艺,包括超声波辅助钎焊、气体保护电弧钎焊、等离子钎焊等的研究都取得一系列新的结果及应用.此外,计算机数值模拟技术,包括固/液界面润湿行为的分子动力学模拟、钎焊接头应力场和温度场的有限元模拟也被用来揭示钎焊过程的现象和机理.

Based on the latest four international conferences on welding and joining technologies held in the past three years,the latest advances in brazing and soldering technologies were concluded.Many useful research results have been achieved in the aspects of new solder for light-weight alloys(such as titanium alloys,aluminum alloys,magnesium alloys),and low-temperature fillers including Sn-based Pd-free solder and Au-Ge system filler,as well as high-temperature fillers for ceramic joining.Reactive air brazing method was applied in the study on ceramic joining and some new progress has been indeed made.The study on the nano-composite filler for Mo/Mo-Re alloys and the diffusion bonding using nano-layered foil are novel.Reviews and comments were made on research advances on the special brazing technologies such as ultrasonic induction brazing,arc brazing,and plasma brazing.Some special joining technologies have been put into engineering application.Furthermore,the computer numerical simulation technology has been developed to reveal the phenomenon and mechanism in brazing processes,such as the molecular dynamics simulation of wetting phenomena and FE modeling of stress field and temperature field in the brazed joints.