摘要
BGA是当今最流行的封装技术,其封装的精度决定了芯片的性能,在对典型视觉系统分析后,本文提出了单目对中视觉系统,并确定了芯片和焊盘与系统的距离,对采集到的图像用小波多尺度算法对其进行边缘检测,验证的系统的可行性,为后续研究提供参考。
BGA is the most popular encapsulation technology,its encapsulates the accuracy of performance,decided the chip in for typical visual system analysis,this paper presents a monocular visual system,and to determine the chips and pad and system distance,for the collected with wavelet multiscale image edge detection algorithm of the feasibility of the system,validation,and provide a reference for further research.
出处
《机电产品开发与创新》
2011年第3期118-120,共3页
Development & Innovation of Machinery & Electrical Products
