摘要
利用扫描电子显微镜(SEM)和透射电子显微镜(TEM)研究了Sn3.8Ag0.7Cu(Sn37Pb)/Cu焊点在时效过程中的界面金属间化合物(IMC)形貌和成份。结果表明:150℃高温时效50、100、200、500h后,Sn3.8Ag0.7Cu(Sn37Pb)/Cu焊点界面IMC尺寸和厚度增加明显,IMC颗粒间的沟槽越来越小。50h时效后界面出现双层IMC结构,靠近焊料的上层为Cu6Sn5,邻近基板的下层为Cu3Sn。之后利用透射电镜观察了Sn37Pb/Ni和Sn3.8Ag0.7Cu/Ni样品焊点界面,结果显示,焊点界面清晰,IMC晶粒明显。
The present work studied the IMC morphology and composition at the interface of aged Sn3.8Ag0.7Cu(Sn37Pb)/Cu joints by SEM and TEM.It was found that IMC layer thickness and grain size increased with the increase of aging time.After 50 h aging,Sn3.8Ag0.7Cu(Sn37Pb) /Cu joints exhibited a duplex intermetallic compound structure;i.e.a layer of Cu6 Sn5 close to the solder and a layer of Cu3 Sn adjacent to the Cu substrate.Finally the interface of FIB prepared Sn37Pb/Ni and Sn3.8Ag0.7Cu/Ni sample was examined under TEM.TEM images showed that the interfacial structure and IMC grain were evident.
出处
《电子显微学报》
CAS
CSCD
北大核心
2011年第2期102-107,共6页
Journal of Chinese Electron Microscopy Society
基金
浙江省自然科学基金资助项目(No.Y4100809)