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Sn3.8Ag0.7Cu和Sn37Pb焊点界面显微结构研究 被引量：1

Interfacial microstructures of Sn3.8Ag0.7Cu and Sn37Pb joints
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摘要 利用扫描电子显微镜(SEM)和透射电子显微镜(TEM)研究了Sn3.8Ag0.7Cu(Sn37Pb)/Cu焊点在时效过程中的界面金属间化合物(IMC)形貌和成份。结果表明:150℃高温时效50、100、200、500h后,Sn3.8Ag0.7Cu(Sn37Pb)/Cu焊点界面IMC尺寸和厚度增加明显,IMC颗粒间的沟槽越来越小。50h时效后界面出现双层IMC结构,靠近焊料的上层为Cu6Sn5,邻近基板的下层为Cu3Sn。之后利用透射电镜观察了Sn37Pb/Ni和Sn3.8Ag0.7Cu/Ni样品焊点界面,结果显示,焊点界面清晰,IMC晶粒明显。 The present work studied the IMC morphology and composition at the interface of aged Sn3.8Ag0.7Cu（Sn37Pb）/Cu joints by SEM and TEM.It was found that IMC layer thickness and grain size increased with the increase of aging time.After 50 h aging,Sn3.8Ag0.7Cu（Sn37Pb） /Cu joints exhibited a duplex intermetallic compound structure;i.e.a layer of Cu6 Sn5 close to the solder and a layer of Cu3 Sn adjacent to the Cu substrate.Finally the interface of FIB prepared Sn37Pb/Ni and Sn3.8Ag0.7Cu/Ni sample was examined under TEM.TEM images showed that the interfacial structure and IMC grain were evident.
作者 刘平 姚琲 顾小龙 赵新兵 刘晓刚
机构地区 浙江省冶金研究院有限公司浙江省钎焊材料与技术重点实验室 浙江大学材料科学与工程学系 天津大学材料科学与工程学院
出处 《电子显微学报》 CAS CSCD 北大核心 2011年第2期102-107,共6页 Journal of Chinese Electron Microscopy Society
基金 浙江省自然科学基金资助项目(No.Y4100809)
关键词 Sn3.8Ag0.7Cu Sn37Pb 金属间化合物 扫描电镜(SEM) 透射电镜(TEM) Sn3.8Ag0.7Cu Sn37Pb IMC SEM TEM
分类号 TG401 [金属学及工艺—焊接]
  • 相关文献

参考文献7

  • 1Kim K S,Huh S H,Suganuma K.Effects of intermetallic compounds on properties of Sn-Ag-Cu lead free soldered joints[J].Journal of Alloys and Compounds,2003,352(1):226-236.
  • 2Lee H T,Chen M H,Jao H M,et al.Influence of interracial intermetallic compound on fracture behavior of solder joints[J].Materials Science and Engineering A,2003,358(1-2):134-141.
  • 3Lee H T,Chen M H.Influence of intermetallic compounds on the adhesive strength of solder joints[J].Materials Science and Engineering A,2002,333 (1 -2):24 -34.
  • 4Tu P L,ChartYah C,Lai J K L.Effect ofintermetallie compounds on the thermal fatigue of Surface mount solder joints[J].IEEE Transactions on Components Packaging and Manufacturing Technology-Part B,1997,20 (1):87-93.
  • 5John Pang H L,Low T H,Xiong B S,et al.Thermal cycling aging efectson Sn-Ag-Cu solder joint microstructure IMC and strength[J].Thin Solid Films,2004,462-463:370-375.
  • 6Kim K S,Yu C H,Yang J M.Aging treatment characteristics of solder bump joint for high reliability optical module[J].Thin Solid Films,2004,462 -463:402-407.
  • 7李晓延,杨晓华,兑卫真,吴本生,严永长.时效对Sn-3.8Ag-0.7Cu／Cu焊料接头的组织和拉伸性能的影响[J].机械强度,2008,30(1):24-28. 被引量：7

二级参考文献8

  • 1李晓延,严永长,史耀武.金属间化合物对SnAgCu/Cu界面破坏行为的影响[J].机械强度,2005,27(5):666-671. 被引量：27
  • 2Pang John H L,Low T H,Xiong B S,et al.Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure,IMC and strength[J].Thin Solid Films,2004,462-463:370-375.
  • 3Kim Kyung-Seob,Yu Chung-Hee,Yang Jun-Mo.Aging treatment characteristics of solder bump joint for high reliability optical module[J].Thin Solid Films,2004,462-463:402-407.
  • 4Masazumi Amagai,Masako Watanabe,Masaki Omiya,et al.Mechanical characterization of Sn-Ag-based lead-free solders[J].Microelectronics Reliability,2002,42(6):951-966.
  • 5Lee Hwa-Teng,Chen Ming-Hung,Jao Huei-Mei,et al.Influence of interfacial intermetallic compound on fracture behavior of solder joints[J].Materials and Engineering A,2003,358(1-2):134-141.
  • 6Zeng K,Kivilahti J K.Use of multi-component phase diagrams for predicting phase evolution in solder/conductor systems[J].J.Electr.Mater.,2001,30(1):35-44.
  • 7Kim Kyung-Seob,Huh S H,Suganuma K.Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints[J].Journal of Alloys and Compounds,2003,352:226-236.
  • 8Tu P L,Chan Yan C,Lai J K L.Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints[J].IEEE Transactions on Components Packaging and Manufacturing Technology-Part B,1997,20(1):87-93.

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电子显微学报
2011年 第2期

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