纳米金/巯基化合物修饰金电极的制备及电化学行为研究

FABRICATION OF GOLD NANOPARTICLES AND THIOL MOMOMER MODIFIED GOLD ELECTRODES AND STUDY ON THE ELECTROCHEMICAL BEHAVIOR

在裸金电极上分别自组装1,2-二(4-巯基苯)乙烯(MPE)、4,4'-二甲基联苯硫醇(MTP),再在6nm纳米金溶胶中修饰纳米金,得纳米金巯基修饰金电极。研究了两巯基纳米金修饰金电极的电化学行为和阻抗行为。

The self-assembled monolayer（SAM） of 1,2-bis（methanethiol）ethylene（MPE） or 4,4-bis（sulfanylmethyl）biphenyl（MTP） on to a bare gold electrode to make self-assembled monolayer.It was then dipped into a 6nm gold nanoparticle solution for period of time at 4℃,the NG/Totil monolayer /Au electrode was prepared.It′s electrochemical behaviors investigated by electrochemical impedance spectroscopy and cyclicvoltammetry technology.The results show that microconfiguration of the gold nanoparticles of the electrode surface has an important influences of the electron transfer.