温度及加载压力对低温下固-固接触热阻的影响

Influence of temperature and pressure on solid to solid thermal contact resistance

利用激光光热法,以铜-不锈钢为研究对象,在温度为70～290K和加载压力0.23～0.68MPa范围内进行了实验,并对测试数据进行了分析.实验结果表明:在一定加载压力下,随温度升高,接触界面热阻不断减小,而且在温度为70～100K内的变化要较100～290K剧烈;随着压力增大,接触热阻也有所减小,但变化不大.利用实验数据进行回归分析,建立接触热阻与温度和压力之间的回归模型,其相对误差小于10%,回归模型和回归系数具有较好的显著性.

An experiment on copper-stainless steel was carried out by laser photothermal method （LPM）. The thermal contact resistance of copper-stainless steel was measured when the temperatwre is 70～290 K and the pressure is 0.23～0.68 MPa. The experimental results show that when temperature increases the thermal contact resistance decreases at different loading pressures, and the thermal contact resistance will decrease more severely when temperature is from 70 to 100 K than from 100 to 290 K; thermal contact resistance decreases slightly when pressure increases. The regression model of contact resistane with temperature an pressure was established by regression analysis the experiment data. The relative error between experimental data and complete quadratic model is less than 10 % by fitting the experimental data, and the regression model and regression coefficient with good significant.