摘要
讨论了SnAgCu305焊料和Cu焊盘在不同回流时间下形成的金属间化合物的厚度和形貌,以及焊点内部的组织结构。通过剪切试验测得不同回流时间下得到的焊点强度。试验结果表明:回流时间较短时,IMC层的厚度随着时间的增大快速增长,随着时间推移最后IMC的厚度在5μm左右趋于稳定。焊点内部的组织形貌随着时间变化由等轴晶到枝状晶,最后变为柱状晶。回流时间在60s时焊点的抗剪切性能最佳。
Discuss the thickness and morphology of intermetallic compounds（IMCs） formed on Cu pad in different soldering times,and also study the microstructure in the solder joint.After shear strength test,get the relationship between soldering time and shear strength.Using the SnAgCu305 solder,the test results show that when the reflow time is short,the thickness of IMCs increases rapidly with time,but with the time goes by the increasing speed is slow down,finally stable at about 5 μm.The microstructure of the solder joints show three crystal morphology of equiaxed grains,dendrites and columnar crystals.The shear resistance of the solder joint is best when the reflow time is 60 s.
出处
《电子工艺技术》
2011年第3期136-137,159,共3页
Electronics Process Technology
