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BGA空洞控制的回归分析研究 被引量：4

Study on Regression Analysis for BGA Void Control
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摘要 阐述了一种基于回归算法的建模方式,通过假设论证的方法分析和推断出了各因子对BGA空洞大小的影响力及相关性,并对模型在现实意义上进行了一系列的分析,为BGA空洞的控制提供了一种科学的和量化可控的方法。 Expound a modeling approach based on the regression algorithm,inferred by assumption arguments various factors’ influence on BGA void size as well as their correlation,and present a series of analysis on practical significance of the model.Provide a scientific,quantitative and controllable method for BGA void control.
作者 桂晟偲 刘佳
机构地区 株洲南车时代电气股份有限公司
出处 《电子工艺技术》 2011年第3期148-151,共4页 Electronics Process Technology
关键词 BGA 多元线性回归 空洞控制 BGA Multiple linear regression Void control
分类号 TN605 [电子电信—电路与系统]
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二级参考文献10

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  • 2Peng C T, Liu C M, Lin J C et al. Reliability analysis and design for the fine - pitch flip chip BGA packaging [ J ]. IEEE transactions on components and packaging technologies,2004, 27 (4) :684 - 693.
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  • 4Cheng Y T, Hsu W T, Khalil N et al. Vacuum pack - aging technology using localized aluminum/silicon - to - glass bonding[ J]. Journal of microelectromechanical systems,2002,11 (5) :556 -565.
  • 5Hong S M,Kang C S,Jung J P. Flux -free direct chip attachment of solder - bump flip chip by Ar + H(2)plasma treatment [ J ]. Journal of electronic materials,2002,31 (10):1104-1111.
  • 6Yunus M, Primavera A, SrihariK et al. Effect of voids on the reliability of BGA/CSP solder joints [ J ]. Microelectronics reliability ,2003,43 ( 12 ) :2077 - 2086.
  • 7Primavera A A, Sturm R, Prasad. Factors that affect void formation in BGA assembly [G]//Proc of IPC/SMTA electronics assembly expo 1998, Providence, Rl,1998.
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共引文献35

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二级引证文献17

电子工艺技术
2011年 第3期

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