摘要
相对于传统的Sn-Pb焊料,无铅焊料更容易氧化,润湿性较差,从而影响波峰焊接质量。N2保护可以降低无铅焊料的氧化,提高无铅焊料的润湿性,从而提高波峰焊接质量。从润湿性的机理分析了N2保护提高无铅焊料润湿性的原因,并通过润湿性实验和波峰焊接试验证实了N2保护的优越性。
Lead-free solder alloys are more easily oxygenized and have poor wettability comparing with traditional Sn-Pb solder alloys,which affects joints reliabilities of wave soldering.The oxidation of lead-free solder alloys can be prevented and the wettability of lead-free solder alloys can be improved in nitrogen environment,which increases joints reliabilities of wave soldering.Lead-free solder alloys wettability mechanism was analyzed and the effects of nitrogen protection were substantiated by wettability and wave soldering experiments.
出处
《电子工艺技术》
2011年第3期185-187,共3页
Electronics Process Technology
关键词
N2保护
无铅焊料
波峰焊
润湿性
Nitrogen protection
Lead-free solder alloys
Wave soldering
Wettability
