等离子体清洗工艺对镁基金属表面形貌及膜/基结合强度的影响

Effect of plasma cleaning process on the surface morphology and adhesion strength of Mg alloy substrate

采用不同等离子体清洗工艺对镁基金属样品进行清洗,随后磁控溅射沉积纯Cr镀层。利用SEM、划痕仪分析了不同等离子体清洗工艺下镁基金属的表面形貌与膜/基结合强度的变化。结果表明,过高的清洗偏压作用下,基体表面会产生深径比>0.5的孔洞状结构缺陷;过长清洗时间后,离子轰击产生的能量积淀效应使基体表面温升显著,局部区域出现熔融、烧结现象,二者均使后续沉积镀层结合强度变低。

Mg alloy substrate samples were cleaned at different plasma cleaning process and pure Cr coatings were deposited using magnetron sputtering technique.Surface micrographs of Mg alloy substrate and adhesion strength of the coatings were analyzed by SEM and scratch tester.The results show that：the substrate surface is shown the deep-hole diameter is greater than 0.5-like structural defects owing to excessive cleaning voltage.After long time cleaning the energy accumulation effect generated the temperature increase significantly by the ion bombardment of the substrate surface and the local region shown the melting,sintering phenomenon.Both of them made the adhesion strength of following accumulated coatings decreased.