积层(Build-up)封装工艺的发展及其设计挑战(2)
Build-up packaging technology development and design challenge(2)
摘要
（接上期）其它建立在积层层中，作为电源岛（Pls）层面（15um铜厚）能加强电源网络的分布。这些被添加到所有的层面中，包括那些分配到信号打线的层。例如微处理器的芯板区域，它只有非常少的信号需要布线但对高电流有很大的需求。电源岛的建立能给店员管理带来很多益处，但也成为信号层限制打线量的一个因素。将电源岛尽可能接近芯片能带来极大的益处。分配电源岛给特定电源区域能优化总的电流控制。使用电源岛能抵消一些不利影响，
出处
《印制电路信息》
2011年第6期7-13,共7页
Printed Circuit Information
参考文献24
-
1International Technology Roadmap for Semiconductors (ITRS)--2003 Edition: Assembly and Packaging, Sematech, Inc., Austin, TX.
-
2D. Edenfeld, A. B. Kahng, M. Rodgers, and Y. Zorian, '2003 Technology Roadmap for Semiconductors,' Computer 37, No. 1, 47-56 (2004).
-
3R. Shukla, V. Murali, and A. Bhansali, 'Flip Chip CPU Package Technology at Intel: A Technology and Manufacturing Overview,' Proceedings of the Electronic Components and Technology Conference, IEEE, May 1999, pp945-949.
-
4G. Harmon, Wirebonding in Microelectronics, Materials, Process, Reliability, and Yield, Second Edition, McGraw-Hill Book Co., Inc., New York, 1997.
-
5R. Tummala, E. Rymaszewski, and A. Klopfenstein, Eds., Microelectronics Packaging Handbook, Van ' Nostrand Reinhold, New York, 1989.
-
6J. Joly and D. Lambert, 'Solutions to the Needs for Higher Interconnect Density on PWB's: Build Up Technology and Micro Vias,' Proc. SPIE 3830, 204-209 (1999).
-
7Y. Tsukada, S. Tsuchida, and Y. Mashimoto, 'Surface Laminar Circuit Packaging,' Proceedings of the Electronic Components Conference. IEEE, 1992. pp22-27.
-
8J. R. Millar, 'Interpenetrating Polymer Networks. Styrene-Divinylbenzene Co-Polymers with Two and Three Interpenetrating Networks, and Their Sulphonates,' J. Chem. Soc., pp1311-1317 (1960).
-
9M. Nakamura, M. Kato, M. Asai, and H. Takenaka, 'High Reliability, High Density Build Up Printed Circuit Board for MCM-L,' International Conference and Exhibition on Multichip Modules (ICEMCM), Society of Photo Optical Instrumentation Engineers, Bellingham, WA, 1995, pp36-41.
-
10V. K. Nagesh, R. Peddada, R. Ramalingarn, B. Sur, and A. Tai, 'Challenges of Flip Chip on Organic Substrate Assembly Technology,'Proeeedings of the Electronic Components and Technology Conference, IEEE, May 1999, pp975-978.
-
1贾明.检测技术的发展趋势[J].电子产品与技术,2004(10):40-43.
-
2Hiroshi HAYAI,Takamasa AKAMATSU,Toshio KOMIYATANI.Build-up Materials APL Series[J].印制电路信息,2001,9(2):26-30.
-
3佘乃东,刘东亮,温东华.RCC与不同FR-4基板积层结构的Tg考察[J].印制电路信息,2007,15(12):32-34. 被引量：1
-
4陈腾.从普通印制板向BUM板转型[J].印制电路信息,2000(1):31-33.
-
5李述成.分配电源及微机计费机地线系统设计的探讨[J].电子机械工程,1995(4):61-63.
-
6SGM2554系列低内阻限流保护器件 圣邦微电子[J].传感器世界,2012,18(12):53-53.
-
7曾曙.Build-up印制板和MCM基板电测技术[J].印制电路信息,1999,0(7):37-39.
-
8祝大同.积层法多层板发展历程[J].电子与封装,2003,3(6):21-27. 被引量：2
-
9辜信实.涂树脂铜箔(RCC)[J].印制电路信息,1999,0(10):6-8. 被引量：2
-
10业内尺寸最小的便携式媒体播放器电源管理方案[J].国外电子元器件,2008(12):94-94.
