摘要
电镀生产实践中,电震机制(振动器,Shock,超声波)在PCB电镀过程中对孔内和板面的气泡有很大的改善,对深镀能力的提升也有很明显的效果,再加上其安装简单、维护方便,因此在PCB电镀过程中,是一个很有用的工具。本文通过对电震机制进行基础探讨,并针对此设计进行改善、控制。
In plating production practice, shock mechanism （vibrators, Shock, sonography） in PCB electroplating process to the hole and surface bubbles has been greatly improved, with obvious effect on deep plating capability of ascension. Meanwhile it has advantage of simple installation, convenient maintenance, so it is a useful tool in PCB electroplating process. This article discussed shock mechanism and introduced the basic designimprovement, control.
出处
《印制电路信息》
2011年第6期41-45,70,共6页
Printed Circuit Information
关键词
孔破
气泡
电震机制
hole broken
bubble
shock mechanism
