摘要
主要介绍了如何控制丝网印刷法制备的嵌入式电阻的厚度。文章重点讨论了压力、速度、以及固化温度和时间等四个因素,并利用优化试验设计法找出影响薄膜电阻层厚度的主要因素。通过实验了解各因素对薄膜电阻层厚度影响的主次关系:并确定各因素的最佳参数。
The paper mainly introduces that how to control the thickness of embedded resistor, which is produced by tbe screen printing. The paper focuses on discussing the four factors： Pressure, speed, curing temperature and curing time and so on, finding out the main factor affecting the thickness of embedded resistor through optimization experimental design. By experimentation we can know about the primary and secondary relationship of each factor that affects the thickness of thin film resistor, and make sure the optimum parameters ofeach factor.
出处
《印制电路信息》
2011年第6期49-51,共3页
Printed Circuit Information
关键词
丝网印刷
埋嵌电阻
厚度
优化试验设计
screen printing
embedded resistor
thickness
optimization experimental design
