摘要
通过对几种典型无铅钎料的电化学性能的研究,提出了无铅 钎料研究开发及应用时 应考虑因其超电势变化带来的影响问题。试验证明,含铋元素无铅钎料较传统的锡铅钎料超电势低,含铟无素无铅钎料则较锡铅钎料有较高的超电势,并证明这是由 于合金中形成了 In Sn4 化合物的缘故,从 而认为含铋无铅钎料应谨慎地使用于电器元件的焊接生产中,而含铟无铅钎料 则较锡铅钎料具有更高 的电化学安全性,在电器元件的焊接生产中具有良好的应用前景。
Through the study of electrochemical performance of several lead-free solders, it is clear that the influence of over-potential variety on lead-free solders must be taken into consideration when developing and applying them. It has been found that lead-free solders with Bi have lower over-potentials, while lead-free solders with In which attributes to the formation of InSn 4 in alloys have higher over-potentials compared with conventional Tin-Lead solders. Therefore,lead-free solders with Bi must be considered carefully, while lead-free solders with In have higher electrochemical safety when they are applied in welding electrical apparatus. So lead-free solders with In may have good prospects for electronic devices.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
1999年第3期175-180,共6页
Transactions of The China Welding Institution
基金
哈尔滨工业大学现代焊接生产技术国家重点试验室资助
关键词
超电势
无铅钎料
焊接
钎焊
over-potential,lead-free solder,InSn 4