亚微米级Al_2O_3p/6061Al复合材料的扩散焊接

Diffusion bonding mechanism of submicron composite Al_2O_3p /6061Al

研究了亚微米级Ａｌ２Ｏ３ｐ／６０６１Ａｌ 复合材料扩散焊接头强度随焊接参数的变化规律， 采用扫描电镜、透射电镜等手段分析了接头区域微观组织， 探讨了焊接参数、接头微观组织与接头宏观性能之间的联系。指出焊接温度是复合材料扩散焊接最重要的工艺参数， 焊接温度介于基体合金固相线与液相线之间， 接头强度最高值可达到１７０ ＭＰａ； 接合界面的氧化膜阻碍基体原子的扩散， 是复合材料接头强度下降的原因之一。在此基础上成功地实现了亚微米级Ａｌ２Ｏ３ｐ／６０６１Ａｌ

The variation of joint strength with the welding parameters when welding submicron composite Al 2O 3p/6061Al was studied. The microstructures of joint was analyzed by using TEM and SEM, and the relationships between welding parameters, microstructure and macro properties of welded joint were investigated. The results indicate that the welding temperature is the most important factor for diffusion welding of composite. When the welding temperature range is between solidus and liquidus, the peak joint strength can reach 170 MPa. In addition, the results also indicate that oxide film is the reason to prevent atom diffusion and thus it will reduce joint strength.