摘要
电沉积Al2O3/Cu 复合镀层的光镜及SEM 分析结果表明,复合镀层的组织结构受极板放置方式、电流密度和施镀时间的影响;电沉积初期以平面生长和螺旋生长两种方式进行,并以平面生长为主,形成胞状形态;沉积后期转向基体金属的择尤生长,形成脊状生长形态。
Microstructures of Al\-2O\-3/Cu composite coating by electrolytic codeposition were studied and its growing model was suggested. The results show that microstructures of the coating was influenced by the position of electrode\|plates,current density and plating time. The coating grew in the way of of plane and spiral,especially by plane. The surface appeared small mound shape at the beginning of plating,then developed a ridge shape.
关键词
复合镀层
电沉积
微观结构
生长模型
铜
氧化铝
composite coating,\ electrolytic deposition,\ model,\ Al\-2O\-3/Cu