COSMOS在LED粘片机芯片拾取臂振动分析中的应用

Vibration analysis on the bond head of LED die bonder through COSMOS software

应用COSMOS软件对LED粘片机芯片拾取臂的振动情况进行了分析:通过COS-MOSWorks软件对该结构进行了模态分析得到该结构的固有频率;通过COSMOSMotion软件对该结构进行运动学分析,得到该结构运动过程中的最大加速度,将该结果倒入COSMOSWorks软件对该结构进行静态分析,发现芯片拾取臂的振动问题主要是由于弹簧片的刚性不足引起,适当增加弹簧片的厚度后芯片拾取臂的振动量明显减小,从而使问题得到了有效的解决。

The structure of bond head is analyzed through COSMOS software for vibration： the mode is analyzed on the structure of bond head for the inherent frequency through COSMOSWorks software;the maximum acceleration has been gotten by COSMOSMotion software,and use the result some static analysis is done on the structure of bond head and forearm of the structure through COSMOSWorks software,and the result shows that the vibration of the structure of bond head is caused by the low rigidity of the spring flake,and after the thickness of the spring flake is been increased the problem is solved.