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Fabrication and characteristics of a 4H-SiC junction barrier Schottky diode 被引量:2

Fabrication and characteristics of a 4H-SiC junction barrier Schottky diode
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摘要 4H-SiC junction barrier Schottky(JBS)diodes with four kinds of design have been fabricated and characterized using two different processes in which one is fabricated by making the P-type ohmic contact of the anode independently,and the other is processed by depositing a Schottky metal multi-layer on the whole anode.The reverse performances are compared to find the influences of these factors.The results show that JBS diodes with field guard rings have a lower reverse current density and a higher breakdown voltage,and with independent P-type ohmic contact manufacturing,the reverse performance of 4H-SiC JBS diodes can be improved effectively. Furthermore,the P-type ohmic contact is studied in this work. 4H-SiC junction barrier Schottky(JBS)diodes with four kinds of design have been fabricated and characterized using two different processes in which one is fabricated by making the P-type ohmic contact of the anode independently,and the other is processed by depositing a Schottky metal multi-layer on the whole anode.The reverse performances are compared to find the influences of these factors.The results show that JBS diodes with field guard rings have a lower reverse current density and a higher breakdown voltage,and with independent P-type ohmic contact manufacturing,the reverse performance of 4H-SiC JBS diodes can be improved effectively. Furthermore,the P-type ohmic contact is studied in this work.
出处 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2011年第6期33-35,共3页 半导体学报(英文版)
基金 project supported by the National Natural Science Foundation of China(No61006060) the 13115 Innovation Engineering of Shannxi Province,China(No2008ZDKG-30)
关键词 4H-SIC junction barrier Schottky field guard ring 4H-SiC junction barrier Schottky field guard ring
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参考文献12

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同被引文献30

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  • 2陈刚,李哲洋,柏松,任春江.Ti/4H-SiC Schottky Barrier Diodes with Field Plate and B^+ Implantation Edge Termination Technology[J].Journal of Semiconductors,2007,28(9):1333-1336. 被引量:2
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