CSP元件的返修过程

Rework Process for Chip-Scale Package

ＣＳＰ元件在返修领域给当今的电子工业带来许多挑战。为了能够成功地返修ＣＳＰ，返修设备制造商必须认真地考虑大家共同遵守的具体准则。文章主要讨论如何满足和超越ＣＳＰ 元件的特殊需要，使大家在返修ＣＳＰ中更顺利。

As the Chip-Scale Package presents today′s electronics manufacturing industry with many challenges in both the rework and repair environment,one must seriously consider the specific criteria that must be followed in order to implement a successful rework process.The intent of this paper is to touch upon how those particular requirements can be met,or even exceeded,while maintaining user friendliness.