Fe基体上Ni膜和Cu基体上Ag膜的膜内应力

Internal Stresses in Ni film on Fe Substrate and Ag film on Cu Substrate

直流电沉积法在Fe基体上制备Ni膜和在Cu基体上制备Ag膜,利用悬臂梁法在线测量了膜中的平均应力,并计算了膜内分布应力,且对膜内平均应力的实验结果与Thomas?Feimi?Dirac?Cheng(TFDC)电子模型理论估算结果进行了对比。结果表明,Fe基体上Ni膜的平均应力和分布应力均为拉应力,而Cu基体上Ag膜的平均应力和分布应力均为压应力。两种膜的内应力均由界面应力引起。对于相同的基体和镀膜,膜内平均内应力的理论估算值与实验值较接近。

Ni film on Fe substrate and Ag film on Cu substrate are prepared by electroplating method.The cantilever beam method is used to measure average internal stresses of the films in situ.Distributed internal stresses in Ni and Ag films are calculated.Theoretical internal stresses are calculated using Thomas–Feimi–Dirac–Cheng（TFDC） electron theory model,which are compared with experimental results.The results show that average and distributed internal stresses in Ni films on Fe substrates are tensile stresses,while average and distributed internal stresses in Ag films on Cu substrates are pressure stresses.These internal stresses are caused by interfacial stresses.The experimental internal stresses are close to theoretical results.