摘要
为了解决印刷电路板中BGA器件的焊点数字化成像质量差、容易漏检等特点,采用MeteorII—CameraLink型图像采集卡、HAWK—160XI型X射线源以及UNIQ—1800CCD相机为基本组成部件,设计了针对焊点数字化成像的高分辨率X射线缺陷检测系统。在分析了射线源焦点尺寸对成像贡献的基础上,计算出最佳成像效果所需的参数。对于实时采集叠加降噪提出了适合工业应用的帧积分叠加方法,对采集的图像进行叠加显示可以实现较好的实时显示效果。经实验测试,最佳放大率时系统分辨率达17 lp/mm,缺陷分析精度最小分辨率达到0.03 mm,同时给出了测试采集效果图。
To solve the poor digital imaging quality and defect detection problem of solder joint of BGA device in the printed circuit board.A high-resolution X-ray flaw detection system is designed,using MeteorII-CameraLink acquisition card,HAWK-160XI X-ray source and UNIQ-1800 CCD camera.On the basis of analyzing the contribution of the ray source focal size to the imaging results,the parameters that best imaging results needed is calculated.For superposition denoise of real-time collection,the frame integral superposition method suitable for industrial applications is proposed to realize superposition function.And good real-time effects for superposition display of captured image is achieved.By testing,the systemic resolution of optimal magnification achieves 17 lp/mm,the minimum resolution of defect analysis precision achieves 0.03mm,and the result picture of collection test is given.
出处
《传感器与微系统》
CSCD
北大核心
2011年第6期106-108,111,共4页
Transducer and Microsystem Technologies
基金
国家青年科学基金资助项目(50605058)
