摘要
热设计是影响电子设备可靠性的一个重要因素,电子设备的小型化对热设计提出了更高的要求。对某小型化电子设备在方案阶段进行了热设计及热仿真分析,并对产品实物的散热进行了试验验证,探讨了小型化电子设备的一种热设计及试验验证方法。
Thermal design is very important for reliability of electronic equipments.Due to miniaturization of electronic equipment,the higher request is put forward to the thermal design.Thermal design and thermal analysis of the miniaturization of an electronic equipment were carried out in the conceptual stage,and the heat distribution of the product was verified through experiment.A method of thermal design and experiment was argued about miniaturization of electronic equipment.
出处
《盐城工学院学报（自然科学版）》
CAS
2011年第2期47-49,共3页
Journal of Yancheng Institute of Technology:Natural Science Edition
关键词
热设计
电子设备
小型化
Thermal design
Electronic equipment
Miniaturization
