期刊文献+

立方织构Ni/Cu双金属基带制备(英文)

Fabrication of Cube-Textured Ni/Cu bi-Metallic Substrate
原文传递
导出
摘要 对在铜带上沉积Ni层过程中,电化学参数对Ni层立方织构形成的影响进行了研究。研究结果显示:只有当阴极电位足够低、镀液pH值在3到4之间时,Ni层才具有立方织构。电化学参数对Ni层立方织构形成的影响可以用几何选择理论进行解释。最后,对Ni层立方织构的热稳定性也进行了研究。 The influences of electro-depositing parameters on the formation of cube-textured Ni layer on Cu tape were studied.Results show that the cube texture can be obtained when the cathode potential is low enough and the pH value of electrolyte is in an appropriate range from 3 to 4.The influences of electro-depositing parameters could be explained by the geometrical selection theory.Finally,the thermal stability of texture of Ni layers was also investigated.
出处 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2011年第6期941-945,共5页 Rare Metal Materials and Engineering
基金 National High Technology Research and Development Program of China(2006AA03Z202,2006AA03Z204) Supported by the French Embassy in Beijing,the International Laboratory for the Applications of Superconductor and Magnetic Materials(LAS2M-CNRS-NIN)
关键词 Ni/Cu双金属基带 电沉积 立方织构 织构热稳定性 涂层导体 Ni/Cu bi-metallic substrate electro-deposition cube texture thermal stability of texture coated conductors
  • 相关文献

参考文献25

  • 1Norton D P, Goyal A, Budai J D et al. Science[J], 1996, 274(5288): 755.
  • 2Iijima Y, Tanabe N, Kohno O et al. Appl Phys Lett[J], 1992, 60(6): 769.
  • 3Zhou Y X, Naguib R, Fang H et al. Supercond Sci Technol[J], 2004, 17:947.
  • 4Eickemeyer J, Selbmann D, Opitz R et al. Physica C[J], 2002, 372-376:818.
  • 5Boer B, Eickemeyer J, Reger Net al. Acta Mater[J], 2001, 49: 1421.
  • 6Thompson J R, Goyal A, Christen D K et al. Physica C[J], 2002, 370:169.
  • 7Soubeyroux J L, Bruzek C E, Girard A et al. IEEE Trans Appl Supercond[J], 2005, 15:2687.
  • 8Shi K, Zhou Y, Meng Jet al. Physica C[J], 2003, 386:353.
  • 9Yust N A, Nekkanti R, Brunke L Bet al. Supercond Sci Technol[J], 2005, 18:9.
  • 10Jin M J, Han S C, Sung T H et al. Physica C[J], 2000, 344:243.

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部