摘要
对使用了8种粘结材料的12mmSAC305薄型球形栅格阵列(CTBGA)封装组件进行了热循环测试。结果显示,所有的粘结材料都降低了组件的热循环可靠性。具有较低线(热)膨胀系数,较高玻璃转化温度和储能模量的粘结材料可使组件热疲劳寿命相对更长,如使用了材料E(αll=48×10-6/℃;αl2=184×10-6/℃;θg=138℃;Es=3.660GPa)的组件比使用了同为边沿绑定材料D(αll=157×10-6/℃;αl2=198×10-6/℃;θg=78℃;Es=0.674GPa)的组件特征寿命增长了25.88%,首次失效时间延迟了57.71%。
The assemblies of 12 mm chiparray thin core ball grid array（CTBGA） components with Sn3.0Ag0.5Cu（SAC305） solder balls were mounted to the PCB and tested in thermal cycling with 8 adhesives.Results show that all of present adhesives reduce the thermal cycle reliability of assemblies.The adhesives with lower cofficient of thermal expansion（CTE） and higher glass transition temperature（θg） and storage modulus（Es） lead to longer thermal fatigue lifes of assemblies.For example,the characteristic life of assemblies with edge bond adhesive E（αll = 48×10-6/℃;αl2 = 184 ×10-6/℃;θg=138 ℃;Es = 3.660 GPa） is increased by 25.88% compared with that of assemblies with edge bonding adhesive D（αll = 157×10-6/℃;αl2=198 ×10-6/℃;θg=78 ℃;Es= 0.674 GPa）,and the time to first failure is delayed by 57.71%.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2011年第7期67-71,共5页
Electronic Components And Materials
