摘要
以邻苯二胺和长链脂肪酸为原料，合成了４ 种２ － 烷基苯并咪唑，并进行了性质测定和结构表征。以制备的２ － 烷基苯并咪唑为主要成份配制成印制电路板用的水溶性予焊剂，通过应用试验表明，该予焊剂能有效防止铜表面氧化，并具有极佳的可焊性。
The title compounds were prepared for 0-phenylenediamine and fat acids.The paper tested the physical property of the compounds and charaeterised their structure.The aqueous preflux was made of 2-alkylbenzimidazole and applied to some experiments.The result of the tests showed that the preflux could prevent oxidation of copper and had exllent solderbility.
