埋置型叠层微系统封装技术

An Embedded Overlay Microsystems Packaging

包含微机电系统(MEMS)混合元器件的埋置型叠层封装,此封装工艺为目前用于微电子封装的挠曲基板上芯片(COF)工艺的衍生物。COF是一种高性能、多芯片封装工艺技术,在此封装中把芯片包入模塑塑料基板中,通过在元器件上形成的薄膜结构构成互连。研究的激光融除工艺能够使所选择的COF叠层区域有效融除,而对封装的MEMS器件影响最小。对用于标准的COF工艺的融除程序进行分析和特征描述,以便设计一种新的对裸露的MEMS器件热损坏的潜在性最小的程序。COF/MEMS封装技术非常适合于诸如微光学及无线射频器件等很多微系统封装的应用。

An embedded overlay concept for packaging hybrid components containing micro-electromechanical systems（MEMS） is described.This packaging process is a derivative of the chip-on-flex（COF） process currently used for microelectronics packaging.COF is a high performance,multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.A laser ablation process has been developed which enables selected areas of the COF overlay to be efficiently ablated with minimal impact to the packaged MEMS devices.Analysis and characterization of the ablation procedures used in the standard COF process was performed to design a new procedure which minimized the potential for heat damage to exposed MEMS devices.The COF/MEMS packaging technology is well-suited for many microsystem packaging applications such as micro-optics and radio frequency（RF） devices.