摘要
采用真空热压烧结法制备了20vol%SiC/Cu-Al2O3复合材料,观察了其显微组织,进行了XRD分析,并测试了性能。结果表明:该材料致密度为97.6%,组织较为致密,显微硬度达165 HV,导电率为25%IACS;在950℃下,碳化硅与铜发生反应生成Cu9Si。
20vol%SiC/Cu-Al2O3 composite was prepared by vacuum-pressed sintering,the microstructure and properties of the composite were observed and tested,respectively.The results show that the density,microhardness and electrical conductivity of the composite are 97.6%,165 HV and 25%IACS,respectively.There is a reaction between SiC and copper matrix at 950 ℃,and the generated product is Cu9Si.
出处
《热加工工艺》
CSCD
北大核心
2011年第12期77-78,80,共3页
Hot Working Technology
基金
河南科技大学博士科研启动基金资助项目(09001199)
