摘要
SiO2光纤预制棒是制备通信光纤的母体材料,为制备性能优良且价格低廉的SiO2光纤预制棒芯棒,本文以正硅酸乙酯和水为主要原料,乙醇为溶剂,HCl和NH3.H2O为催化剂,甲酰胺为添加剂,采用溶胶-凝胶工艺,且在不同温度(50,60,70,75,80,90℃)下经热处理制得SiO2干胶。讨论了不同摩尔比的水/正硅酸乙酯、乙醇/正硅酸乙酯、HCl/NH3.H2O及溶液pH值对凝胶形成的影响,防裂剂甲酰胺的加入可在一定程度上缓解和阻止SiO2干胶微裂纹的形成。经XRD分析:不同热处理温度下制备的SiO2干胶均为非晶态;红外光谱分析:SiO2干胶为硅氧四面体结构;扫描电镜分析:热处理温度高于75℃时,表面裂纹急剧增多。结果表明SiO2干胶的最佳热处理温度(凝胶出现时间最短且干胶防裂性能最优)为75℃。
SiO2 optical fiber perform was parent material of communication optical fiber.This paper use TEOS and water as main materials,alcohol as solvent,hydrochloric acid and ammonia water as catalyst,formamide as additive to prepare SiO2 optical perform jel based on SG method,and heated at different temperature（50,60,70,75,80,90℃） to prepare the dry gel.It has discussed different molar ratio of water/TEOS,alcohol/TEOS,hydrochloric acid/ammonia water and pH effecting on preparation of SiO2 gel.Formamide can delay and resist crack form on SiO2 dry gel.XRD analysis showed SiO2 dry gel prepared at different temperature were all amorphous.Infrared spectroscopic analysis showed structural of SiO2 dry gel was silicatetrahedron.SEM analysis：surface cracks increased when heat temperature was above 75℃.Results showed the best heat temperature（gel appeared earliest and least surface cracks appeared on dry gel） was 75℃.
出处
《化学工程师》
CAS
2011年第6期8-10,13,共4页
Chemical Engineer
基金
黑龙江省教育厅资助项目(一般项目)(11531046)
