由铜基Sn-Zn合金去合金化制备亚微米多孔材料

PREPARATION OF SUB-MICRON POROUS MATERIALS BY DEALLOYING Cu-BASED Sn-Zn ALLOY

采用电化学沉积结合热处理的方法,制备出类棉絮状结构的铜基Sn-Zn合金,再用一定浓度的H2SO4溶液和NaOH溶液自由腐蚀去合金化制备的亚微米多孔材料.扫描电镜照片表明,通过2wt%H2SO4溶液去合金化的样品形成了分布较为均匀的平均孔径尺寸约400nm、孔隙与孔壁尺寸接近1/1的多孔结构;通过9wt%NaOH溶液腐蚀去合金化的样品形成了分布较不均匀的平均孔径尺寸约1μm、孔隙与孔壁尺寸接近1/2的多孔结构.

Cu-based Sn-Zn alloys with cotton-wool-like microstructure were prepared by heat treatment and electrochemical deposition. Sub-micron porous materials were synthesized by dealloying Cu-based Sn-Zn alloys in alkaline or acid solutions, and their morphologies were charaterized by scanning electron microscopy （SEM）. SEM results showed that sub-micron porous materials with the average pore diameter of about 400 nm can be obtained by dealloying the sample in a 2 wt% H2SO4 solution, and the ratio between pore and pore wall was about 1/1; moreover, sub-micron porous materials with the average pore diameter of about 1 μm can be obtained by dealloying them in a 9 wt% NaOH solution and the ratio between pore and pore wall is about 1/2.