铜线键合优势和工艺的优化

The Advantage and Process Optimization for Copper Wire Bond

半导体封装对于芯片来说是必须的,也是至关重要的。封装可以指安装半导体集成电路芯片用的外壳,它不仅起着保护芯片和增强导热性能的作用,而且还起到沟通芯片内部世界与外部电路桥梁和规格通用功能的作用。文章阐述了铜线键合替代金线的优势,包括更低的成本、更低的电阻率、更慢的金属间渗透。再通过铜线的挑战——易氧化、铜线硬度大等,提出了在实际应用中工艺的优化,如防氧化装置、铜丝劈刀的参数、压力和超声的优化等。

Regarding the chip,it is not only necessary but also a must.It can also be said that the seal refers to the other casing which the installed semiconductor integrated circuit uses.It not only improves the protection of the chip and enhanced heat transmission performance but also links the chips interior and exterior electric bridge circuit standard functions.Expound the advantage of the replacement of the golden wire by copper wire,include the low cost,resistance and IMC growth.For the challenge of copper wire-easy oxidation,hardness and so on,put forward the process optimization in the practical application,such as equipment for anti-oxidization,parameter optimization for press and ultrasonic,the capillary for copper wire and so on.