空间用元器件热真空试验评价方法研究

Study on the Test Method of Thermal Vacuum of the Device for Space Application

空间用元器件热真空试验是空间环境模拟试验中非常重要的一项试验,文章通过对空间用元器件热真空环境应力的分析,给出了不同轨道的温度范围以及不同真空度下空间用元器件的物理效应;对空间用元器件热真空试验评价方法进行了研究和探讨,在参照组件、分系统、整星热真空试验方法的基础上,提出了器件级热真空试验程序。介绍了已开展的DC/DC混合集成电路和双向收发器单片集成电路的热真空试验情况和试验结果。试验结果表明,通过热真空试验,可以对空间用元器件热真空环境下的性能和可靠性进行试验评价,为航天用户单位合理选用空间用元器件提供科学依据。

The thermal vacuum test of the device for space is very important to the simulated test of space environment.This paper analyses the stress of the thermal vacuum of the device for space application,the temperature range for the different orbits and physical effects for the vacuum level have been presented.The thermal vacuum test method of the device for space application has been studied,on the base of referring on the test method of component,subsystem,satellite,the thermal vacuum test program has been gived.The general situation thermal vacuum test of DC/DC and bidirectional transceiver has been introduced,test results indicate that the test method of thermal vacuum can evaluate the performance and reliability of the hybrid integrated circuit and the monolithic integrated circuit in the space vacuum thermal enviroments,and can give the scientific proof for the space parts selection.