提高多芯片微波模块气密性的研究

Study of Improving Microwave Module Hermetic Package with the Multi-Layout Chip

伴随着现代微电子技术的高速发展,在一些特殊环境条件下使用的各种微波模块,需要进行密封封装,以防止器件中的电路因潮气、大气中的离子、腐蚀气氛的浸蚀等引起失效,采用气密性封装以延长器件的使用时间。密封的实现方式根据具体要求采取不同的措施,对于密封要求相对较低,可以采用锡封的方式实现;对于密封要求相对较高的,可以采用平行封焊的方式实现。影响平行缝焊质量的有诸多因素,盖板与平行缝焊的关系是相当重要的,在壳体性能稳定的情况下,盖板质量的好坏直接影响着器件的气密性,盖板和管壳之间的匹配、工艺参数的设置、电极表面的状态等对平行缝焊的质量都起着重要的作用。

With the fast development of the microelectronics technology,various microwave modules using under some special environment conditions need to seal package to prevent failures of the electric circuit in it because of the etching of the dampness,the ion in atmosphere,decay atmosphere,etc.The use time of module can be extended by hermetic sealing.The difference hermetic requirements for various microwave module need to difference hermetic method.According to lower hermetic requirements,the microwave module can be achieved by Sn Sealing technics.According to higher hermetic requiremetnt,can be achieved by paralled seam welding.There are many influence factors of the quality of the parallel seam welding.The lids＇ quality is very important.While the function of the tube socket is stable,the quality of lids influences the hermeticity of devices directly,the match of shell and lid,setting of process parameters,the conditions of electrode surface have important influence on the quality of the parallel seam welding.