超临界CO_2流体环境中线路板分层实验分析

Analysis of layered experiments on printed circuit board in the environment with supercritical CO_2 fluid

在超临界CO2流体环境下,当温度达到240℃以上时,印刷线路板就会发生分层现象。同时,在实验中发现在非超临界流体环境下,当温度达到260℃以上时,线路板也会发生分层现象。从线路板粘接材料发生热解反应的角度出发,在对比超临界CO2流体环境下与非超临界流体环境下的线路板分层效果的基础上,对超临界CO2流体环境下的线路板分层做出合理分析,最后发现临界CO2流体对线路板分层过程有促进作用,并对其分层效果有优化作用。

The printed circuit board（PCB） takes delamination in supercritical CO2 fluid above 240 ℃.Meanwhile,experiments show that the PCB also takes delamination in non-supercritical fluid above 260 ℃.Based on the comparison of PCB delamination effects in the situation of supercritical CO2 fluid and non-supercritical fluid,in view of PCB adhesive material thermal decomposition reaction,a reasonable analysis was made.The analysis indicates that the supercritical CO2 fluid can facilitate the process of the stratification of PCB and optimize the delamination effect of PCB.