丙烯酸酯干膜光刻胶曝光特性及其应用

Exposure Properties and Application of Acrylate-Based Dry Film Photoresists

对一种新型的丙烯酸酯干膜光刻胶(DFP)的曝光及显影特性进行了研究,采用该干胶制作出微沟道结构,进行微流道实验研究。在4英寸(1英寸=2.54cm)硅片上实现了厚度为50μm的干胶完好贴敷,从而解决了干胶在硅衬底上的贴敷问题。利用改变曝光时间设定曝光剂量梯度的方法,研究了干胶的曝光特性。采用不同质量分数的显影液,研究干胶的显影特性,获得了优化的结果。采用干胶系统进行了微流体沟道制作,得到了侧壁陡直的微沟道结构。实验发现,65mJ/cm2及以上的曝光剂量可使厚度为50μm的干膜光刻胶充分曝光并获得形貌效果良好的微结构,质量分数为5%的显影液具有最快的显影速度。

Exposure and development characterization of a novel photopolymer dry film photoresist（DFP）based on acrylate were investigated,and the experiment of the micro-channel fabricated on-chip with DFP was carried out.The lamination of the 50 μm-thickness photoresist film was realized on 4 inch silicon substrates to solve the lamination problem of the dry film photoresist on the silicon substrate.The exposure properties of the DFP were researched by the exposure time dependent on exposure dose control method,and its developing property was investigated with control of concentration gradient.The developing properties of DFP were investigated by the different developer concentrations to obtain the optimization results.The micro-channel was fabricated by DFP system and the micro-channel structures with the steep side wall were obtained.The experiments show that 65 mJ/cm2 and above exposure dose can make 50 μm-thickness dry film photoresist exposure fully and obtain the excellent microstructure morphology.The developer with 5% mass concentration has the fastest rate of developing.