摘要
The number of the dummy via can significantly affect the interconnect average temperature.This paper explores the modeling of the interconnect average temperature in the presence of multiple dummy vias.The proposed model incorporates the multi-via effect into the effective thermal conductivity of the interlayer dielectric (ILD) to obtain accurate results.Using different ILDs,the multi-via effect is analyzed and discussed.Also,the extended applications of the multi-via effect are presented in this paper to obtain the minimum interconnect average temperature increase with a given via separation or number.This study suggests that the multi-via effect should be accounted for in integrated circuits design to optimize the performance and design accuracy of integrated circuits.
The number of the dummy via can significantly affect the interconnect average temperature.This paper explores the modeling of the interconnect average temperature in the presence of multiple dummy vias.The proposed model incorporates the multi-via effect into the effective thermal conductivity of the interlayer dielectric （ILD） to obtain accurate results.Using different ILDs,the multi-via effect is analyzed and discussed.Also,the extended applications of the multi-via effect are presented in this paper to obtain the minimum interconnect average temperature increase with a given via separation or number.This study suggests that the multi-via effect should be accounted for in integrated circuits design to optimize the performance and design accuracy of integrated circuits.
基金
supported by the National Natural Science Foundation of China (60606006)
the National Science Fund for Distinguished Young Scholars of China (60725415)
the Basic Science Research Fund of Xidian University
关键词
互连
温度变化
集成电路设计
平均温度
平均气温
层间绝缘
优化设计
ILD
interconnect modeling
interconnect average temperature increase
multi-via effect
dummy via
interlayer dielectric
