摘要
铜在防渗铜镀层中的扩散系统是评价镀层防渗铜能力的重要参数。采用电子显微探针法,“俣野”数值方法推导出扩散系数。并分析了铜在柱状和块状镍镀层中的扩散系数。
Diffusion coefficient of copper in barrier coating is a considerable parameter for evaluating barrier ability. Diffusion coefficient can be deduced from matano method using electronic microprobe. Diffusion characteristics of copper in lamellar and columnar nickel deposit are also determined.
出处
《电镀与涂饰》
CAS
CSCD
1999年第4期29-31,共3页
Electroplating & Finishing
关键词
扩散系数
防渗铜
镀层
电镀
镀镍
diffusion coefficient
electronic microprobe
copper barrier