摘要
化学镀作为一种功能精饰技术，特别是在电子工业中受到越来越广泛的关注。本文以大量的文献阐述了铜、镍、金、钯及其它化学镀在电子工业中的应用。
Electroless plating as a functional finishing, has been adopted more and more, particularly in electronic industry. Electroless plating of copper, nickel, gold, palladium and other metals in electronic industry were described with 64 references.
出处
《电镀与涂饰》
CAS
CSCD
1999年第4期42-50,60,共10页
Electroplating & Finishing
关键词
化学镀
电子工业
电镀
electroless plating
copper
nickel
gold
palladium
electronic industry
