摘要
对彩管屏锥封接工序中所使用的材料和工艺过程,从力学的角度,对材料的强度和热处理前后材料内部的应力状态进行分析,对该工艺过程产生裂管的原因及应采取的对策进行了探讨。
By analyzing material strength and fore and aftstress state in the heat treatment of the working procedure based on mechanical theories,the reasons of the tube burst and effective countermeasures in the firt seal working procedure are investigated.
出处
《真空电子技术》
1999年第5期14-19,42,共7页
Vacuum Electronics