摘要
介绍了一种新的镍基焊料的开发应用情况。新焊料的力学、物理和焊接性能完全能满足电子工业中铜和低碳钢的焊接。该焊料取代了传统工艺采用的DHLAgCu50焊料，达到了降低成本和节银的目的。
A new Ni-based filler metal is introduced. Its mechanical, physical and brazing properties canperfectly satisfy the brazing of copper and low carbon steel in the electronic industry. The traditioinal filler metalDHLAgCu50 has been replaced. The cost of the filler is reduced and silver is not used.
出处
《机械工程材料》
CAS
CSCD
北大核心
1999年第6期29-32,共4页
Materials For Mechanical Engineering
