纳米W、Cu固溶行为的研究

Solid Solution Behavior of Nanocrystalline W,Cu

采用溶胶-喷雾干燥-热还原法制备了纳米W-Cu复合粉末,用日产3014-2Z型X射线自动衍射仪对W-Cu复合粉末和烧结坯进行物相分析。通过衍射图谱可以观察到经三步还原后的W-Cu复合粉末,存在W相和Cu相,通过精确测量各晶面所对应的衍射角,并采用标准Si校正,得到各种粉末和烧结坯中W相和Cu相的晶格常数,结果表明:这些数值与其分别对应的标准晶格常数0.3165 nm和0.3615 nm相比,出现一定偏差,说明W相和Cu相均存在一定的固溶,在烧结过程中,随着烧结温度的升高,W在Cu中的固溶度逐渐增大。

Nano-grained W powder and Cu powder are produced by spray drying and subsequent thermal reduction process.The solid solution characteristics of nano-crystalline powder and its sintering process are studied by XRD analysis.It can be observed from the diffraction pattern that there are W phase and Cu phase.We can get the lattice parameter of the powder and the material.The results show that the lattice parameter from the XRD analysis is a little different from the standard lattice parameter.The solution of W in Cu increases with rising sintering temperature.