摘要
盲孔裂缝是高密度互连印制电路板(HDI)在无铅回焊时最常见的盲孔可靠性问题之一,其影响因素多,原因复杂。文章通过盲孔互连测试板,运用实验设计(DOE)手法对材料、激光能量、除胶速率、沉铜前微蚀大小、化学沉铜厚度、电镀前铜面清洗等进行了实验。结果表明,激光能量和沉铜前微蚀控制是造成盲孔裂缝的显著因子,激光能量选用16/14/12(3shot)和微蚀量控制1.5μm时效果最佳,不会产生盲孔裂缝问题。
Blind via crack is one of important reliability failure mode of HDI, and there are many factors which can cause it. This article studies the failure mode based on material, laser energy, desmear weight loss, microetch rate, electroless copper thickness and acid cleaning through HDI test vehicle by DOE. Result shows that laser energy and micro-etch rate are the key factors of micro-via crack, laser energy select 16/14/12（3shot） and microetch rate control 1.5urn are the best product parameter, that can prevent to make micro-via crack in lead free reflow.
出处
《印制电路信息》
2011年第7期24-28,共5页
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